Plasma service
Plasma service
BP is dedicated to innovate advanced plasma system and provide outstanding surface treatment cleaning, activation and modification (Hydrophilic/hydrophobic surface) and ITO electrode , PCB industrial electron, printing surface cleaning technology, which is an ideal facility for surface cleaning and modification.
Features
Cleaning of surface (before bonding, soldering or gluing)
Activation of surface (before printing vanishing or gluing)
Etching of surface (before micro structuring of silicon or etching of PTFE)
Modification of surface Plasma polymerization (Deposit of hydrophobic/hydrophilic layers)
Major Applications
ITO Electrode surface cleaning before production LCD.
Electrode surface cleaning for COB process
Surface cleaning or modification for IC packaging (Flip chip,CSP,BGA,TCP or Lead
Frame,etc.) or LED packaging.
Surface cleaning activation, modification and removal technology for PCB.
Surface cleaning activation or modification technology for industrial electronic components.
Surface roughing or cleaning before printing or sticking
|
|
|
