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•Product Description and Application
Electronic Packaging and Finishing Technologies which is represented by Bestrade Precision’s engineer teams. Our line of chemistries for electronics and metal finishing applications includes next-generation lead-free solder plating processes as well as traditional tin-lead soldering technologies and base metal plating processes. Our expertise in formulating advanced plating additives has secured our position as a global leader in the development of specialized plating technologies for use in the electronics, aerospace, military and general metal finishing industries. Our processes are used in the plating of semiconductor lead frames, connectors, wire, flat stock, sheet steel and discrete components such as resistors, capacitors and diodes. Our processes can be used in high-speed reel-to-reel applications as well as in conventional rack and barrel plating.
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