| Lead frame is the 'skeleton' of the chip (or die) package, providing mechanical support to the die during its assembly into a finished product. It consists of a chip paddle, to which the chip is attached, and leads, which serve as the means for external electrical connection to the outside world. The chip is connected to the leads by wires through wire bonding or by tape automated bonds.
•Type
Stamped, Etched
•Applications
Substrate to assembly semiconductor
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